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| NSR05F20NXT5G Schottky Barrier Diode These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. Features http://onsemi.com * * * * * * Low Forward Voltage Drop - 390 mV @ 500 mA Low Reverse Current - 15 mA @ 10 V VR 500 mA of Continuous Forward Current ESD Rating - Human Body Model: Class 3B ESD Rating - Machine Model: Class C High Switching Speed These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant LCD and Keypad Backlighting Camera Photo Flash Buck and Boost dc-dc Converters Reverse Voltage and Current Protection Clamping & Protection Mobile Handsets MP3 Players Digital Camera and Camcorders Notebook PCs & PDAs GPS 20 V SCHOTTKY BARRIER DIODE 1 CATHODE 2 ANODE 2 MARKING DIAGRAM 1 PIN 1 05F20 YYY Typical Applications * * * * * * * * * * DSN2 (0402) CASE 152AC 05F20 YYY = Specific Device Code = Year Code Markets ORDERING INFORMATION Device NSR05F20NXT5G Package Shipping DSN2 5000 / Tape & Reel (Pb-Free) MAXIMUM RATINGS Rating Reverse Voltage Forward Current (DC) Forward Surge Current (60 Hz @ 1 cycle) ESD Rating: Human Body Model Machine Model Symbol VR IF IFSM ESD Value 20 500 10 >8 > 400 Unit V mA A kV V For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. (c) Semiconductor Components Industries, LLC, 2010 July, 2010 - Rev. 1 1 Publication Order Number: NSR05F20/D NSR05F20NXT5G THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction-to-Ambient (Note 1) Total Power Dissipation @ TA = 25C Thermal Resistance Junction-to-Ambient (Note 2) Total Power Dissipation @ TA = 25C Storage Temperature Range Junction Temperature Symbol RqJA PD RqJA PD Tstg TJ Min Typ Max 240 521 94 1.3 -40 to +125 +150 Unit C/W mW C/W W C C 1. Mounted onto a 4 in square FR-4 board 50 mm sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. 2. Mounted onto a 4 in square FR-4 board 1 in sq. 1 oz. Cu 0.06" thick single sided. Operating to steady state. ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted) Characteristic Reverse Leakage (VR = 10 V) (VR = 20 V) Forward Voltage (IF = 100 mA) (IF = 500 mA) Symbol IR Min Typ Max 15 75 0.330 0.390 0.345 0.430 Unit mA VF V http://onsemi.com 2 NSR05F20NXT5G TYPICAL CHARACTERISTICS 1 IF, FORWARD CURRENT (A) 100000 Ir, REVERSE CURRENT (mA) 10000 1000 100 10 1 0.1 0.01 0.001 0 4 8 12 16 20 25C 150C 125C 75C 0.1 150C 0.01 125C 75C 25C -25C -25C 0.001 0 0.10 0.20 0.30 0.40 0.50 VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V) Figure 1. Forward Voltage 180 CT, TOTAL CAPACITANCE (pF) 160 140 120 100 80 60 40 20 0 0 4 8 12 Figure 2. Leakage Current TA = 25C 16 20 VR, REVERSE VOLTAGE (V) Figure 3. Total Capacitance http://onsemi.com 3 NSR05F20NXT5G PACKAGE DIMENSIONS DSN2, 1.0x0.6, 0.575P, (0402) CASE 152AC-01 ISSUE B 0.05 C D AB E 0.05 C TOP VIEW 0.05 C A 0.05 C A1 SIDE VIEW C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. DIM A A1 b D E L L2 L3 MILLIMETERS MIN MAX 0.25 0.31 --- 0.05 0.45 0.55 1.00 BSC 0.60 BSC 0.85 0.95 0.35 0.45 0.20 0.30 CATHODE BAND MONTH CODING DEC SEP JUN MAR FEB JAN NOV OCT 0.05 C A B L L/2 1 b 0.05 C A B XXXX YYY XXXX Y09 INDICATES AUG 2009 DEVICE CODE YEAR CODE L3 L2 (EXAMPLE) BOTTOM VIEW RECOMMENDED SOLDER FOOTPRINT* 1.20 0.47 PIN 1 0.60 0.60 DIMENSIONS: MILLIMETERS See Application Note AND8398/D for more mounting details *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 4 NSR05F20/D |
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